Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
نویسندگان
چکیده
منابع مشابه
Characterization of the viscoelastic properties of an epoxy molding compound during cure
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the st...
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We have developed an analytical formula for the cure progress of epoxy systems as a function of both time t and temperature T. Complex viscosity h* or the storage modulus G' are used as the measures of the cure progress. The equation is based on the shape of the isothermal viscosity vs. time curves typically found for thermoset systems; temperature dependence of the isothermal parameters is est...
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ژورنال
عنوان ژورنال: Polymers
سال: 2021
ISSN: 2073-4360
DOI: 10.3390/polym13111734